CPU PRO Thermal Paste, 30g, up to 230 ℃

When it comes to heat dissipation between the CPU or GPU and the heatsink, choosing the right thermal paste is crucial. The CPU PRO thermal paste with 30 g content was specifically developed for demanding systems where maximum reliability and efficient heat transfer are essential. Whether it's a high-end gaming PC, workstation, or server - this paste ensures optimal temperatures and reliably protects your hardware from overheating.

With a thermal conductivity coefficient of over 1.93 W/m·K, it enables outstanding heat dissipation. The high viscosity of 380 ± 10 (1/10 mm) guarantees even distribution without air pockets - ideal for precise work. The thermal impedance is below 0.225 °C·in²/W, ensuring maximum efficiency. Thanks to its high density of over 2.4 g/cm³, the paste remains stable and reliable even during extended operation.

The operating temperature ranges from -20 °C to +230 °C, while the paste can even withstand temperatures of up to 280 °C for short periods - perfect for systems under continuous load or overclocking.

With a 30-gram fill quantity, this product is ideal for system builders, repair services, or anyone who regularly optimizes cooling solutions - far more than a single application.

Product benefits at a glance:

✔ High thermal conductivity > 1.93 W/m·K
✔ Large fill quantity: 30 g for multiple applications
✔ Temperature-resistant up to 280 °C (short-term)
✔ Viscosity: 380 ± 10 (1/10 mm)
✔ Thermal impedance < 0.225 °C·in²/W
✔ Operating temperature: -20 °C to +230 °C
✔ Density: > 2.4 g/cm³

Whether for gaming enthusiasts, professional system integrators, or hobbyist PC builders - with the CPU PRO thermal paste 30 g, you get a powerful, long-lasting solution for excellent cooling.