CPU PRO Thermal Paste, 30g, up to 230 ℃

When it comes to heat dissipation between the CPU or GPU and the heatsink, choosing the right thermal paste is crucial. The CPU PRO thermal paste with 30 g content was specially developed for demanding systems where maximum reliability and efficient heat transfer are essential. Whether it's a high-end gaming PC, workstation, or server – this paste ensures optimal temperatures and reliably protects your hardware from overheating.

With a thermal conductivity coefficient of over 1.93 W/m·K, it enables outstanding heat dissipation. The high viscosity of 380 ± 10 (1/10 mm) guarantees even distribution without air bubbles – ideal for precise application. The thermal impedance is below 0.225 °C·in²/W, ensuring maximum efficiency. Thanks to a high density of over 2.4 g/cm³, the paste remains stable and reliable even during extended use.

The operating temperature ranges from -20 °C to +230 °C, while the paste can withstand temperatures up to 280 °C for short periods – perfect for systems under continuous load or overclocking.

With a 30 gram filling amount, this product is ideal for system builders, repair services, or anyone who regularly optimizes cooling solutions – far more than just a single application.

Product benefits at a glance:

✔ High thermal conductivity > 1.93 W/m·K
✔ Large filling amount: 30 g for multiple applications
✔ Temperature resistant up to 280 °C (short-term)
✔ Viscosity: 380 ± 10 (1/10 mm)
✔ Thermal impedance < 0.225 °C·in²/W
✔ Operating temperature: -20 °C to +230 °C
✔ Density: > 2.4 g/cm³

Whether for gaming enthusiasts, professional system integrators, or hobby PC builders – with the CPU PRO thermal paste 30 g, you get a powerful, durable solution for excellent cooling.