CPU PRO Thermal Paste, 3g, up to 230 ℃

The CPU PRO thermal paste is the ideal solution for anyone who wants to get the most out of their hardware. Whether gaming, rendering, or handling demanding workloads – this silicone paste offers you reliable and efficient heat transfer between CPU, GPU, and cooler. With a thermal conductivity coefficient of over 1.93 W/m·K and a thermal resistance up to 280 °C, it ensures consistent performance even under full load.

Thanks to the high concentration of 380 ± 10 (1/10 mm) and a thermal impedance below 0.225 °C·in²/W, heat is optimally dissipated. The paste spreads easily and evenly – perfect for experienced PC builders as well as beginners. With a density value of over 2.4 g/cm³, it is ideally suited for a durable and secure connection between heatsink and processor.

Reliable in all situations: The CPU PRO thermal paste is temperature resistant between -30 °C and +280 °C and operates reliably within the working range of -20 °C to +230 °C. Whether summer heat or long-term stress – your system stays cool and powerful.

Technical highlights:

✔ Thermal conductivity > 1.93 W/m·K
✔ Temperature resistance up to 280 °C
✔ Thermal impedance < 0.225 °C·in²/W
✔ Viscosity: 380 ± 10 (1/10 mm)
✔ Density: > 2.4 g/cm³
✔ Content: 2.4 g – ideal for multiple applications

Whether you are optimizing your gaming PC, installing a new CPU, or just want to be on the safe side – with the CPU PRO thermal paste, you choose a professional solution that delivers on its promises.