CPU PRO Thermal Paste, 3g, up to 230 ℃

The CPU PRO thermal paste is the ideal solution for anyone who wants to get the most out of their hardware. Whether gaming, rendering, or demanding workloads - this silicone paste provides reliable and efficient heat transfer between the CPU, GPU, and cooler. With a thermal conductivity coefficient of over 1.93 W/m·K and thermal resistance of up to 280 °C, it ensures consistent performance even under full load.

Thanks to its high consistency of 380 ± 10 (1/10 mm) and thermal impedance below 0.225 °C·in²/W, heat is dissipated optimally. The paste spreads easily and evenly - perfect for experienced PC builders and beginners alike. With a density of over 2.4 g/cm³, it is ideal for a durable and secure connection between the heatsink and processor.

Reliable in all conditions: The CPU PRO thermal paste is temperature-resistant between -30 °C and +280 °C and operates reliably within a range of -20 °C to +230 °C. Whether in summer heat or under long-term loads - your system stays cool and performs reliably.

Technical highlights:

✔ Thermal conductivity > 1.93 W/m·K
✔ Temperature resistance up to 280 °C
✔ Thermal impedance < 0.225 °C·in²/W
✔ Viscosity: 380 ± 10 (1/10 mm)
✔ Density: > 2.4 g/cm³
✔ Contents: 2.4 g - ideal for multiple applications

Whether you are optimizing your gaming PC, installing a new CPU, or simply want to play it safe - with the CPU PRO thermal paste, you are choosing a professional solution that delivers on its promises.